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The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit.
About the AuthorProf. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.
Wafer fabrication.- Thermal oxidation.- Lithography.- Etching technology.- Doping techniques.- Chemical and Physical Deposition.- Metallization and Contacts.
Henrietta Acquah-Swanzy, Ibrahim Mwammenywa, Irene Ngoti, Lillian Donna Namujju, Godiana Philipo, Stefan Trittler, Henry Asiimwe, Joachim Böcker, Henrik Bode, Paul Bogere, Ulrich Hilleringmann, Josephine Nakato Kakande, Teddy Mangeni, James Musana, Christine Freitag, Katrin Temmen, Stefan Krauter, Tobias Klaus, Burkhard Hehenkamp
Henrietta Acquah-Swanzy, Ibrahim Mwammenywa, Irene Ngoti, Lillian Donna Namujju, Godiana Philipo, Stefan Trittler, Henry Asiimwe, Joachim Böcker, Henrik Bode, Paul Bogere, Ulrich Hilleringmann, Josephine Nakato Kakande, Teddy Mangeni, James Musana, Christine Freitag, Katrin Temmen, Stefan Krauter, Tobias Klaus, Burkhard Hehenkamp