Microelectronics Packaging Handbook

Subsystem Packaging Part III

Inbunden, Engelska, 1997

AvR.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein,R. R. Tummala,Rao R. Tummala,Tummala,R R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein

2 029 kr

Beställningsvara. Skickas inom 10-15 vardagar. Fri frakt för medlemmar vid köp för minst 249 kr.

Finns i fler format (3)

Inbunden

2 699 kr

Skickas inom 10-15 vardagar

Inbunden

4 669 kr

Skickas inom 10-15 vardagar

Häftad

2 699 kr

Skickas inom 10-15 vardagar

This text is the third of three volumes to update the author's earlier one-volume "Microelectronics Handbook", first published in 1988. Revised to incorporate advances in the industry, this volume provides a balance of theory and practical applications. It explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures.

Produktinformation

Utgivningsdatum1997-01-31
Mått155 x 235 x 43 mm
Vikt993 g
FormatInbunden
SpråkEngelska
Antal sidor628
Upplaga2
FörlagChapman and Hall
ISBN9780412084515

Tillhör följande kategorier

Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.