Del 62 i serien Advances in Heat Transfer

Electronics Cooling: From the Chip to the Datacenter

Inbunden, Engelska, 2026

3 099 kr

Kommande

Electronics Cooling: From the Chip to the Datacenter, Volume 62 provides a concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.

From micro- and nano-scale cooling mechanisms at the chip level to macro-scale cooling in data centers
Bridges fundamental heat transfer with system-level thermal management
Detailed treatment of conduction, convection (natural and forced), radiation, phase change, and two/three-phase cooling

Produktinformation

Utgivningsdatum2026-11-01
Mått152 x 229 x undefined mm
Vikt450 g
FormatInbunden
SpråkEngelska
SerieAdvances in Heat Transfer
Antal sidor300
FörlagElsevier Science
ISBN9780443470844

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John Abraham is at University of St. Thomas, Saint Paul, MN, USA John Gorman is at University of Minnesota, Minneapolis, MN, USA Kambiz Vafai is a mechanical engineer, inventor, academic and author. He has taken on the roles of Distinguished Professor of Mechanical Engineering and the Director of Bourns College of Engineering Online Master-of-Science in Engineering Program at the University of California, Riverside. Vafai is most known for his pioneering work in phenomenological description, modeling and analysis for single and multiphase transport through porous media. His publications include journal articles and books such as Porous Media: Applications in Biological Systems and Biotechnology and the Handbook of Porous Media. Additionally, he is the recipient of the 75th Anniversary Medal of American Society of Mechanical Engineers (ASME) Heat Transfer Division in 2013, the 2006 ASME Memorial Award, and the 2011 International Society of Porous Media (InterPore) Honorary Lifetime Membership Award. Vafai is a Fellow of the American Society of Mechanical Engineers (ASME), the American Association for Advancement of Science (AAAS), the World Innovation Foundation, and Associate Fellow of American Institute of Aeronautics and Astronautics (AIAA). He has taken on the roles of Editor-in-Chief of the Journal of Porous Media and Special Topics and Reviews in Porous Media, Editor of International Journal of Heat and Mass Transfer and has held positions on the Editorial Advisory Board of the International Journal of Heat and Mass Transfer, International Communications in Heat and Mass Transfer, Numerical Heat Transfer Journal, International Journal of Numerical Methods for Heat and Fluid Flow, Experimental Heat Transfer Journal, and editorial board of the International Journal of Heat and Fluid Flow. Contact Reference 167207 Contact TypePersonCategoryNo Category AssignedDivisionsElsevier