Encapsulation Technologies for Electronic Applications
Haleh Ardebili, Jiawei Zhang, Michael G. Pecht, Rice University) Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, USA) Zhang, Jiawei (Staff Engineer, Qualcomm, San Diego, CA, USA) Pecht, Michael G. (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland
2 819 kr