Data & IT
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Khaled Salah • Yehea Ismail • Alaa El-Rouby
Inbunden
1999:-
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Andra format:
- Pocket/Paperback 1999:-
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
- Illustratör: 58 schwarz-weiße und 5 farbige Tabellen 44 schwarz-weiße und 99 farbige Abbildungen Bibliographie
- Format: Inbunden
- ISBN: 9783319076102
- Språk: Engelska
- Antal sidor: 179
- Utgivningsdatum: 2014-09-05
- Förlag: Springer International Publishing AG