Vetenskap & teknik
Pocket
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
Asme
4279:-
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The proceedings of InterPACK2021 explore the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
- Format: Pocket/Paperback
- ISBN: 9780791885505
- Språk: Engelska
- Antal sidor: 648
- Utgivningsdatum: 2022-05-30
- Förlag: American Society of Mechanical Engineers,U.S.